Industries · Power Electronics
Aluminum parts for power electronics
Inverters, power supplies and energy-storage systems all need the same thing: aluminum that moves heat and protects electronics. We build the enclosures, heatsinks and cold plates those products rely on — from one drawing, under one quality record.
What power electronics needs from aluminum
Thermal path + enclosure + compliance, in one part where possible.
A power-electronics product lives or dies on three things: it must shed heat from the switching devices, it must house and shield the electronics, and it must meet environmental and safety rules. Aluminum does all three. An IGBT heatsink or inverter heatsink is the thermal path; an extruded housing is the structure and the EMC shield; anodizing insulates and protects. We design these together from your drawing so the mounting seat, the fin and the enclosure datum all reference the same model.
The practical gain is one supplier. A discrete device on a separate heatsink, bolted into a bought enclosure, leaves three shops to disagree on tolerance and finish. Built as one part, the machined seat is cut to the same datum that defined the profile, and the anodize is specified against the alloy we extruded — so fit and thermal contact are predictable, not negotiated.
Heatsinks for power devices
From diodes to IGBT stacks, sized to the dissipation.
IGBT & inverter heatsinks
Extruded or skived fins for IGBT modules, MOSFETs and inverters — base machined flat for thermal contact.
See heatsinks →Cold plates
Liquid cooling for high-power IGBT stacks and battery modules — FSW-welded, leak-tested.
See cold plates →Power-supply & semiconductor
Compact finned sinks for power supplies and discrete semiconductors, extruded or CNC machined.
Fin density and base flatness are confirmed against your device footprint and thermal resistance target.
Enclosures that shield and cool
Structure, EMC and ingress in one extruded section.
We extrude the inverter or drive housing with the gasket channel, EMC groove and internal fins built into the same profile, then CNC-machine the openings for connectors, busbars and the cooling plate. For outdoor or harsh sites we anodize or powder coat to the IP class you specify and verify it on the finished part. Where the power stage runs hot, a liquid cold plate clamps to the devices inside the same housing, so coolant lines and mounting seats line up by design.
Send us
- Power dissipation per device and total
- Cooling method (air / liquid) and constraints
- IP / EMC / environmental requirements
- Envelope and mounting
Compliance & build
How we meet thermal, electrical and documentation needs.
| Need | How we meet it |
|---|---|
| Thermal | Simulated / measured path; fin & cold-plate design to your resistance target |
| Electrical safety | Anodized insulation; creepage-aware layout where specified |
| Environment | IP-rated enclosures; salt-spray anodize for outdoor use |
| Docs | Material certs, inspection, RoHS / REACH |
Questions buyers ask first
Short answers on thermal parts and process.
What is an IGBT heatsink and how do you build it?
An IGBT heatsink is the finned metal base that pulls heat off an IGBT power module. We build it as an extruded or skived-fin aluminum part with the mounting base machined flat so the module sits in full contact — the lower the interface gap, the lower the thermal resistance. For high-power stacks we switch to a liquid cold plate. The base flatness and fin density are set against your module footprint and dissipation.
Air or liquid cooling for my inverter?
It depends on power density. A low- to mid-power inverter is fine with an extruded fin heatsink and convection or a fan. Above the point where the enclosure can no longer shed the heat — often tens of kilowatts — a liquid cold plate clamped to the devices is the economical path. Send the dissipation and envelope and we propose the method in the DFM note.
Can you build the enclosure and heatsink as one part?
Yes. That is the usual arrangement: the housing extruded with internal fins and a machined seat for the device or plate, finished and inspected as one project. Building them together avoids the tolerance gaps you get when a separate heatsink is bolted into a bought enclosure.
Build your power-electronics parts
Share the spec — we propose enclosure, heatsink and cooling as one package.