Heatsinks · Bonded Fin
Bonded fin heatsinks
Bonded fin heatsinks combine an extruded or machined base with thin stamped fins bonded or soldered into slots — achieving high fin aspect ratios that pure extrusion cannot reach.
When to choose bonded
A bonded fin heatsink sits between extruded and skived: it reaches tall, thin fins via stamped aluminum inserts bonded (adhesive) or soldered into a base. Good for high surface area with moderate cost and no extrusion die limit on fin ratio.
Solder bonding gives a stronger thermal joint than adhesive — we select based on power and temperature.
Typical specs
- Fin thickness: 0.2–0.8 mm
- Fin height: up to ~150 mm
- Join: adhesive or soldered
- Alloy: 6063 fins / 6061 base
Capability
| Parameter | Capability |
|---|---|
| Fin aspect ratio | high (tall/thin) |
| Base | extruded or CNC machined |
| Join method | bonded / soldered |
| Finish | anodized / powder coat |
Design tip
- Specify joint type (soldered for high temp/power).
- Allow slot tolerances in the base for fin insertion.
Quote a bonded fin heatsink
Send envelope and thermal load — we propose base + fin construction.